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About this Engineering article
Modeling the Elastic Behavior of an Industrial Printed Circuit Board Under Bending and Shear by Loon, Kuan Teng; Kok, Chee Kuang; Noor, Ervina Efzan Mohd; Ooi, Chin Chin is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Loon, Kuan Teng; Kok, Chee Kuang; Noor, Ervina Efzan Mohd; Ooi, Chin Chin
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2019
- Field
- Engineering (Physical Sciences)