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About this Engineering article
Thermal Modeling of Multi-Fin Field Effect Transistor Structure Using Proper Orthogonal Decomposition by Jia, Wangkun; Helenbrook, Brian T.; Cheng, Ming-Cheng is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jia, Wangkun; Helenbrook, Brian T.; Cheng, Ming-Cheng
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 0018-9383)
- Published
- 2014
- Field
- Engineering (Physical Sciences)
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