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This study investigates the wet removal of photoresist (PR) and bottom anti-reflective coating (BARC) in copper back-end-of-line processing using multifunctional cleaning solutions. Results show that complete removal of PR and BARC can be achieved under specific conditions without damaging porous low-k dielectrics, and subsequent patterning of low-k layers maintains good profiles. The study concludes that wet cleaning processes can effectively replace traditional plasma methods while preserving the dielectr

Author

xhaiyu1212

Language

EN