About this scholarly article

56th Electronic Components and Technology Conference 2006 - Characterization of Intermetallic Compound Formation and Copper Diffusion of Copper Wire Bonding by Shawn Zhang, ; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M. is a scholarly article available to read on EtoBox.

Author

Shawn Zhang, ; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.

Publisher

IEEE

Published

2006

Language

EN