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Non-Destructive Control of Underfill in BGAs by sunerfly is a document available to read on EtoBox.

What is Non-Destructive Control of Underfill in BGAs about?

This document discusses techniques for non-destructively inspecting the underfill of surface mount assemblies like BGA devices. Visual inspection only allows viewing the resin fillets around the component and cannot check for voids under the device. X-ray has limitations in resolving low density materials like underfill resin and distinguishing voids. It can also have beam hardening artifacts. Scanning acoustic microscopy uses ultrasound to detect air gaps but has difficulties imaging under BGA devices due

Author

sunerfly

Language

EN