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About this Engineering article
Buckling Analysis of an Orthotropic Layer Bonded to a Substrate with an Interface Crack by JEONG, K. M.; BEOM, H. G. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- JEONG, K. M.; BEOM, H. G.
- Publisher
- SAGE Publications (ISSN 0021-9983)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)