About this scholarly article

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Comparison of properties of thermo-compression bonded 3D stacks using a liquid and a dry-film wafer level underfills by Duval, F. F. C.; Wang, T.; Capuz, G.; Gerets, C.; Miller, R. A.; Rebibis, K. J.; Beyne, E. is a scholarly article available to read on EtoBox.

Author

Duval, F. F. C.; Wang, T.; Capuz, G.; Gerets, C.; Miller, R. A.; Rebibis, K. J.; Beyne, E.

Publisher

IEEE

Published

2015