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About this Engineering article
Electrical Broadband Characterization Method of Dielectric Molding in 3-D IC and Results by Lacrevaz, Thierry; Bermond, Cedric; El Bouayadi, Ossama; Houzet, Gregory; Artillan, Philippe; Lamy, Yann; Dieng, Khadim; Flechet, Bernard is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lacrevaz, Thierry; Bermond, Cedric; El Bouayadi, Ossama; Houzet, Gregory; Artillan, Philippe; Lamy, Yann; Dieng, Khadim; Flechet, Bernard
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2014
- Language
- EN
- Field
- Engineering (Physical Sciences)