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About this Engineering article
Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers by Au, Yeung; Lin, Youbo; Gordon, Roy G. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Au, Yeung; Lin, Youbo; Gordon, Roy G.
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2011
- Field
- Engineering (Physical Sciences)