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Transient liquid phase bonding with Ga-based alloys for electronics interconnections by Yi Chen; Canyu Liu; Zhaoxia Zhou; Changqing Liu is a Engineering article available to read on EtoBox.

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Significant demands on electronics packaging are driven by miniaturization, energy efficiency, high performance, and minimal carbon footprint. Liquid Ga and Ga-based alloys as interconnect materials exhibit a great potential in these applications due to the benefits including low melting points, non-toxicity, and stable high melting point intermetallic compounds (IMCs) formed with other metals such as Cu. Taking advantages of transient liquid phase bonding (TLPB) technology, the uses of Ga-based alloys can be attractive as a more efficient and environmentally friendly method for interconnections. This study aims to address the technical challenges in the applications of Ga and Ga-based alloys for Cu bonding through the TLPB process. These include solderability of Ga-based solders on Cu, interfacial reactions during bonding, as well as the microstructure and properties of the resultant joints. In addition, the porosity and shear strength of the joints have been evaluated for better understanding of the reliability of the joints. The results show that Ga-based solders present an acceptable solderability given their wetting behavior observed. The constituent of the resultant joints co

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Author

Yi Chen; Canyu Liu; Zhaoxia Zhou; Changqing Liu

Publisher

Elsevier BV

Published

2022

Language

EN

Field

Engineering (Physical Sciences)