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About this Materials Science article
Integrating CoNi nanoparticles encapsulated by few-layer h -BN with excellent thermal conductivity and thermal stability by Fan, Dongliang; Lv, Xiaomeng; Feng, Jin; Zhang, Suyun; Xie, Jimin; Liu, Jun is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Fan, Dongliang; Lv, Xiaomeng; Feng, Jin; Zhang, Suyun; Xie, Jimin; Liu, Jun
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0925-8388)
- Published
- 2017
- Field
- Materials Science (Physical Sciences)
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