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About this Engineering article
An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl 2 O 3 composite solder by Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Chen, Guang; Huang, Bomin; Liu, Hui; Chan, Y.C.; Tang, Zirong; Wu, Fengshun
- Publisher
- Emerald Group Publishing Limited; Emerald (MCB UP ); Emerald Group Publishing Ltd.; Emerald (ISSN 0954-0911)
- Published
- 2016
- Field
- Engineering (Physical Sciences)
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