About this scholarly article

Proceedings Electronic Components and Technology, 2005. ECTC '05. - Effect of Reflow Profiles on the Board Level Drop Reliability of Pb-Free (SnAgCu) BGA Assemblies by Lal, A.; Bradley, E.; Sharda, J. is a scholarly article available to read on EtoBox.

Author

Lal, A.; Bradley, E.; Sharda, J.

Publisher

IEEE

Published

2005

Language

EN