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Can I read In Situ Self-assembled Organoid for Osteochondral Tissue Regeneration with Dual Functional Units on EtoBox?
In Situ Self-assembled Organoid for Osteochondral Tissue Regeneration with Dual Functional Units by Zhen Yang; Bin Wang; Wei Liu; Xiaoke Li; Kaini Liang; Zejun Fan; Jiao Jiao Li; Yudi Niu; Zihao He; Hui Li; Du Wang; Jianjing Lin; Yanan Du; Jianhao Lin; Dan Xing is a Engineering article available to read on EtoBox.
What is In Situ Self-assembled Organoid for Osteochondral Tissue Regeneration with Dual Functional Units about?
The regeneration of hierarchical osteochondral units is challenging due to difficulties in inducing spatial, directional and controllable differentiation of mesenchymal stem cells (MSCs) into cartilage and bone compartments. Emerging organoid technology offers new opportunities for osteochondral regeneration. In this study, we developed gelatin-based microcryogels customized using hyaluronic acid (HA) and hydroxyapatite (HYP), respectively for inducing cartilage and bone regeneration (denoted as CH-Microcryogels and OS-Microcryogels) through in vivo self-assembly into osteochondral organoids. The customized microcryogels showed good cytocompatibility and induced chondrogenic and osteogenic differentiation of MSCs, while also demonstrating the ability to self-assemble into osteochondral organoids with no delamination in the biphasic cartilage-bone structure. Analysis by mRNA-seq showed that CH-Microcryogels promoted chondrogenic differentiation and inhibited inflammation, while OS-Microcryogels facilitated osteogenic differentiation and suppressed the immune response, by regulating specific signaling pathways. Finally, the in vivo engraftment of pre-differentiated customized microcr
Who reads In Situ Self-assembled Organoid for Osteochondral Tissue Regeneration with Dual Functional Units?
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Zhen Yang; Bin Wang; Wei Liu; Xiaoke Li; Kaini Liang; Zejun Fan; Jiao Jiao Li; Yudi Niu; Zihao He; Hui Li; Du Wang; Jianjing Lin; Yanan Du; Jianhao Lin; Dan Xing
- Publisher
- Elsevier BV
- Published
- 2023
- Language
- EN
- Field
- Engineering (Physical Sciences)