About this scholarly article

SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS - Paris, France (Tuesday 9 May 2000)] Design, Test, Integration, and Packaging of MEMS/MOEMS - Advanced flip chip technologies in rf, microwave, and MEMS applications by Oppermann, Hermann H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, Herbert; Courtois, Bernard; Crary, Selden B.; Gabriel, Kaigham J.; Karam, Jean Michel; Markus, Karen W.; Tay, Andrew A. O. is a scholarly article available to read on EtoBox.

Author

Oppermann, Hermann H.; Kallmayer, C.; Klein, M.; Aschenbrenner, R.; Reichl, Herbert; Courtois, Bernard; Crary, Selden B.; Gabriel, Kaigham J.; Karam, Jean Michel; Markus, Karen W.; Tay, Andrew A. O.

Publisher

SPIE

Published

2000