About this Engineering article
Heat-Flux-Based Condition Monitoring of Multichip Power Modules Using a Two-Stage Neural Network by Borong Hu; Zedong Hu; Li Ran; Chong Ng; Chunjiang Jia; Paul McKeever; Peter J. Tavner; Chi Zhang; Huaping Jiang; Philip A. Mawby is a Engineering article available to read on EtoBox.
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- Author
- Borong Hu; Zedong Hu; Li Ran; Chong Ng; Chunjiang Jia; Paul McKeever; Peter J. Tavner; Chi Zhang; Huaping Jiang; Philip A. Mawby
- Publisher
- Institute of Electrical and Electronics Engineers (IEEE)
- Published
- 2021
- Language
- EN
- Field
- Engineering (Physical Sciences)