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About this Engineering article
Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate by Liu, Chia-Yu; Kuo, Po-Cheng; Chen, Chih-Ming; Dai, Jia-Ying; Yen, Yee-Wen; Pasana, Alberto S. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liu, Chia-Yu; Kuo, Po-Cheng; Chen, Chih-Ming; Dai, Jia-Ying; Yen, Yee-Wen; Pasana, Alberto S.
- Publisher
- Springer US; Springer-Verlag; Springer New York LLC; Springer Science and Business Media LLC (ISSN 0361-5235)
- Published
- 2019
- Language
- EN
- Field
- Engineering (Physical Sciences)