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About this Engineering article
Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests by Jau-Sheng Wang; Chun-Chin Tsai; Jyun-Sian Liou; Wei-Chih Cheng; Shun-Yuan Huang; Gi-Hung Chang; Wood-Hi Cheng is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Jau-Sheng Wang; Chun-Chin Tsai; Jyun-Sian Liou; Wei-Chih Cheng; Shun-Yuan Huang; Gi-Hung Chang; Wood-Hi Cheng
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 2012
- Language
- EN
- Field
- Engineering (Physical Sciences)