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About this Engineering article
Sintering of Silver–Aluminum Nanopaste With Varying Aluminum Weight Percent for Use as a High-Temperature Die-Attach Material by Manikam, Vemal Raja; Razak, Khairunisak Abdul; Cheong, Kuan Yew is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Manikam, Vemal Raja; Razak, Khairunisak Abdul; Cheong, Kuan Yew
- Publisher
- Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers Inc.; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 2156-3950)
- Published
- 2012
- Language
- EN
- Field
- Engineering (Physical Sciences)
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