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HotSpot: Compact Thermal Modeling for VLSI by 賴XX is a document available to read on EtoBox.
The paper introduces HotSpot, a compact thermal modeling methodology designed for early-stage VLSI design that effectively models temperature distribution across silicon and packaging layers. It emphasizes the importance of considering thermal effects during the design process to improve efficiency and reduce costs, while providing detailed static and transient temperature information. HotSpot is particularly suited for preregister transfer level (RTL) and presynthesis thermal analysis, offering a computati
- Author
- 賴XX
- Language
- EN