About this scholarly article

2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Analysis of bump resistance and electrical distribution of ultra-fine-pitch microbumps by Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y. is a scholarly article available to read on EtoBox.

Author

Chang, Y. W.; Peng, H. Y.; Yang, R. W.; Chen, Chih; Chang, T. C.; Zhan, C. J.; Juang, J. Y.

Publisher

IEEE

Published

2010

Language

EN