About this Engineering article
Fluidized bed electrodes Part IV. Electrodeposition of copper in a fluidized bed of copper-coated spheres by M. Fleischmann; J. W. Oldfield; L. Tennakoon is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- M. Fleischmann; J. W. Oldfield; L. Tennakoon
- Publisher
- Springer; Springer-Verlag; Kluwer Academic Publishers; Springer Science and Business Media LLC (ISSN 0021-891X)
- Published
- 1971
- Field
- Engineering (Physical Sciences)