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About this Engineering article
New packaging of a chip on a board by a unique printing method : Atsushi Okuno et al. IEEE Trans. Compon. Hybrids mfg Technol. 15, 73 (1992) is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0026-2714)
- Published
- 1992
- Language
- EN
- Field
- Engineering (Physical Sciences)