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Via-Filling Plating in PCB Manufacturing by jack is a document available to read on EtoBox.

What is Via-Filling Plating in PCB Manufacturing about?

The document discusses via-filling plating in the PCB manufacturing process. It explains that via-filling plating involves electroplating copper into blind vias or holes on PCBs to improve electrical and thermal performance. The key factors that influence via-filling include plating parameters like current density, temperature, and waveform. Substrate properties like dielectric material and hole aspect ratio also affect the via-filling process. Via-filling plating is commonly used in high-density PCB design

Author

jack

Language

EN