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About this Engineering article
A Mathematical Model for Chemical–mechanical Polishing Based on Formation and Removal of Weakly Bonded Molecular Species by Yongwu Zhao; L. Chang; S.H. Kim is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Yongwu Zhao; L. Chang; S.H. Kim
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0043-1648)
- Published
- 2003
- Language
- EN
- Field
- Engineering (Physical Sciences)