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About this Engineering article

Dynamic Modeling of Damping Effects in Highly Damped Compliant Fingers for Applications Involving Contacts by Liu, Chih-Hsing; Lee, Kok-Meng is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Liu, Chih-Hsing; Lee, Kok-Meng
Publisher
The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 0022-0434)
Published
2011
Field
Engineering (Physical Sciences)

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