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About this Engineering article
Dynamic Modeling of Damping Effects in Highly Damped Compliant Fingers for Applications Involving Contacts by Liu, Chih-Hsing; Lee, Kok-Meng is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Liu, Chih-Hsing; Lee, Kok-Meng
- Publisher
- The American Society of Mechanical Engineers; ASME International ; American Society of Mechanical Engineers (ISSN 0022-0434)
- Published
- 2011
- Field
- Engineering (Physical Sciences)