Skip to content

Opening book details…

About this scholarly article

2010 IEEE Nanotechnology Materials and Devices Conference - Modeling thermal conductivity and CTE for CNT-Cu composites for 3-D TSV application by Sinha, Arpita; Mihailovic, Jadran A.; Morris, James E.; Lu, Hua; Bailey, Chris is a scholarly article available to read on EtoBox.

Author
Sinha, Arpita; Mihailovic, Jadran A.; Morris, James E.; Lu, Hua; Bailey, Chris
Publisher
IEEE
Published
2010

More by Sinha, Arpita; Mihailovic, Jadran A.; Morris, James E.; Lu, Hua; Bailey, Chris

Browse all works by Sinha, Arpita; Mihailovic, Jadran A.; Morris, James E.; Lu, Hua; Bailey, Chris