About this scholarly article

IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203) - 225 C high temperature silicon-on-insulator (SOI) ASICs for harsh environments by O'Connor, J.M.; Tsang, J.C.; McKitterick, J.B. is a scholarly article available to read on EtoBox.

Author

O'Connor, J.M.; Tsang, J.C.; McKitterick, J.B.

Publisher

IEEE

Published

1998