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About this Engineering article
Analysis of Deformation Process in Ball Bonding in LSI Packaging. Analysis of the Non Steady-State Metal Flow by Physical Simulation. by NAKANISHI, Kenji; OSHIGE, Koji; KAMITANI, Shunpei is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- NAKANISHI, Kenji; OSHIGE, Koji; KAMITANI, Shunpei
- Publisher
- The Japan Society of Mechanical Engineers; Japan Society of Mechanical Engineers/Nihon Kikai Gakkai; Japan Society of Mechanical Engineers (ISSN 0387-5008)
- Published
- 1997
- Field
- Engineering (Physical Sciences)
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