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About this Engineering article
A Micromechanical Model for Deformation Behavior of Nanocrystalline Copper by Lan, Jiao Xia; Wu, Yong Zhong; Hong, You Shi is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Lan, Jiao Xia; Wu, Yong Zhong; Hong, You Shi
- Publisher
- Trans Tech Publications, Ltd.; Trans Tech Publications (ISSN 1662-8958)
- Published
- 2010
- Language
- EN
- Field
- Engineering (Physical Sciences)
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