About this document
Solder Mask Options for Vias by Екатерина Корнеева is a document available to read on EtoBox.
The document discusses different solder mask design options for vias and their pros and cons with respect to reliability and manufacturability. It outlines six primary options: 1) primary LPI solder mask tenting vias, 2) vias not covered, 3) button print, 4) plugged via, 5) active pad, and 6) plating vias shut. Each option is described in detail regarding its process, history, pros, cons, cost and whether it is advised. Primary concerns addressed include via reliability, reworkability, surface finish protec
- Author
- Екатерина Корнеева
- Language
- EN