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About this Engineering article
Reduction of Etch Pits of Electropolished Cu by Additives by Shieh, Jia-Min; Chang, Shih-Chieh; Wang, Ying-Lang; Dai, Bau-Tong; Cheng, Shih-Song; Ting, Jack is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Shieh, Jia-Min; Chang, Shih-Chieh; Wang, Ying-Lang; Dai, Bau-Tong; Cheng, Shih-Song; Ting, Jack
- Publisher
- The Electrochemical Society; Electrochemical Society, Inc. (ISSN 0013-4651)
- Published
- 2004
- Language
- EN
- Field
- Engineering (Physical Sciences)