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About this Engineering article
The Effects of Flux Materials on the Moisture Sensitivity and Reliability of Flip-chip-on-board Assemblies by Beddingfield, C.; Higgins, L.M. is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Beddingfield, C.; Higgins, L.M.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1083-4400)
- Published
- 1998
- Language
- EN
- Field
- Engineering (Physical Sciences)