About this scholarly article

2006 International Conference on Electronic Materials and Packaging - Signal Integrity Analysis and Validation of GHz I/O Interface on Wire Bond Ball Grid Array Technology Package by Since, Huang Jimmy Huat; Lee Chan Kim, ; Lee, Kuan Chin is a scholarly article available to read on EtoBox.

Author

Since, Huang Jimmy Huat; Lee Chan Kim, ; Lee, Kuan Chin

Publisher

IEEE

Published

2006