About this scholarly article

2013 IEEE 63rd Electronic Components and Technology Conference - Investigation of novel solder patterns for power delivery and heat removal support by Brunschwiler, Thomas; Madhour, Yassir; Tick, Timo; Schlottig, Gerd; Oggioni, Stefano is a scholarly article available to read on EtoBox.

Author

Brunschwiler, Thomas; Madhour, Yassir; Tick, Timo; Schlottig, Gerd; Oggioni, Stefano

Publisher

IEEE

Published

2013