About this scholarly article

Conference Record of the 1999 IEEE Industry Applications Conference. Thirty-Forth IAS Annual Meeting (Cat. No.99CH36370) - A new packaging technique for power multichip modules by Gillot, C.; Henry, D.; Schaeffer, C.; Massit, C. is a scholarly article available to read on EtoBox.

Author

Gillot, C.; Henry, D.; Schaeffer, C.; Massit, C.

Publisher

IEEE

Published

1999