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Three-dimensional Nanosprings for Electromechanical Sensors by D.J. Bell; Y. Sun; L. Zhang; L.X. Dong; B.J. Nelson; D. Grützmacher is a Engineering article available to read on EtoBox.

What is Three-dimensional Nanosprings for Electromechanical Sensors about?

This paper presents the use of a novel fabrication technique to produce three-dimensional (3D) nanostructures with nanoscale features that can be used for electromechanical sensors. The process uses conventional microfabrication techniques to create a planar pattern in a SiGe/Si bilayer that then self-assembles into 3D structures during a wet etch release. An additional metal layer can be integrated for higher conductivity. Results from the fabrication of the structures are demonstrated. Nanomanipulation inside a scanning electron microscope (SEM) was conducted to probe the structures for mechanical and electrical characterization. The experimental characterization results were validated by finite element simulation.

Who reads Three-dimensional Nanosprings for Electromechanical Sensors?

Author

D.J. Bell; Y. Sun; L. Zhang; L.X. Dong; B.J. Nelson; D. Grützmacher

Publisher

Elsevier Science; Elsevier ; Elsevier BV (ISSN 0924-4247)

Published

2006

Language

EN

Field

Engineering (Physical Sciences)