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About this scholarly article
2019 IEEE 22nd International Symposium on Design and Diagnostics of Electronic Circuits & Systems (DDECS) - Modular Data Link Layer Processing for THz communication by Lopacinski, L.; Eissa, M. H.; Panic, G.; Hasani, A.; Kraemer, R. is a scholarly article available to read on EtoBox.
- Author
- Lopacinski, L.; Eissa, M. H.; Panic, G.; Hasani, A.; Kraemer, R.
- Publisher
- IEEE
- Published
- 2019
- Language
- EN
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