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An Analytical Method for the Thermal Layout Optimisation of Multilayer Structure Solid-state Devices by Marcello Pesare; Agostino Giorgio; Anna Gina Perri is a Engineering article available to read on EtoBox.

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In this paper an analytical method for the electrothermal solution to the non-linear 3-D heat ̄ow equation for multilayer structure electronic devices is proposed. Compared with previous models presented in literature, it is general and can be easily applied to a large variety of integrated devices, provided that their structure can be represented as an arbitrary number of superimposed layers with a 2-D embedded thermal source, so as to include the eect of the package. The proposed method is independent of the speci®c physical properties of the layers, hence GaAs MESFETs and HEMTs as well as silicon and silicon-on-insulator MOSFETs and heterostructure LASERs can be analysed. Moreover, it takes into account the dependence of the thermal conductivity of all the layers on the temperature; the heat equation is solved coupled with the device current±voltage relation in order to give physical consistence to the experimental evidence that a temperature increase causes a degradation of the electrical performances and that the electrical power is not uniformly distributed.

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Author

Marcello Pesare; Agostino Giorgio; Anna Gina Perri

Publisher

Elsevier Science; Elsevier ; Elsevier Ltd.; Elsevier BV (ISSN 0038-1101)

Published

2001

Language

EN

Field

Engineering (Physical Sciences)