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3D Strain Mapping of Opaque Materials Using an Improved Digital Volumetric Speckle Photography Technique with X-Ray Microtomography by Mao, Lingtao; Liu, Haizhou; Zhu, Ying; Zhu, Ziyan; Guo, Rui; Chiang, Fu-pen is a Engineering article available to read on EtoBox.

What is 3D Strain Mapping of Opaque Materials Using an Improved Digital Volumetric Speckle Photography Technique with X-Ray Microtomography about?

Digital volumetric speckle photography (DVSP) method has been used to strain investigation in opaque materials. In this paper, an improved DVSP algorithm is introduced, in which a multi-scale coarse–fine subset calculation process and a subvoxel shifting technique are applied to increase accuracy. We refer to the new algorithm as Multi-scale and Subvoxel shifting Digital Volumetric Speckle Photography (MS-DVSP). The displacement and strain fields of a red sandstone cylinder exposed to uniaxial compression and a woven composite beam under three-point bending are mapped in detail. The characteristics of the interior deformation of the specimens are clearly depicted, thus elucidating the failure mechanism of the materials.

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Author

Mao, Lingtao; Liu, Haizhou; Zhu, Ying; Zhu, Ziyan; Guo, Rui; Chiang, Fu-pen

Publisher

MDPI AG; Multidisciplinary Digital Publishing Institute (MDPI); Basel: MDPI AG, 2011- (ISSN 2076-3417)

Published

2019

Language

EN

Field

Engineering (Physical Sciences)