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Two-Dimensional Mapping of Interface Thermal Resistance by Transient Thermal Measurement by nanyismoro is a document available to read on EtoBox.
The document presents a technique for mapping the thermal resistance of bonded interfaces in power converters using a transient thermal measurement method. This method involves moving a thermal probe across a substrate to gather data on thermal interface resistance, which is crucial for assessing the reliability of large bonded areas. The technique is validated through experiments on copper-bonded samples and aims to improve thermal management in power electronics.
- Author
- nanyismoro
- Language
- EN