Skip to content

Opening book details…

About this Engineering article

Integration of Materials and Processes for Reliable Silicon Interconnections by Paraszczak, J. is a Engineering article available to read on EtoBox.

It is typically read by researchers, students, and practitioners in Engineering.

Author
Paraszczak, J.
Publisher
AVS (American Vacuum Society); American Vacuum Society; American Institute of Physics (ISSN 0734-211X)
Published
1994
Language
EN
Field
Engineering (Physical Sciences)

More by Paraszczak, J.

Browse all works by Paraszczak, J.