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About this Materials Science article
Silicon Interposer BGA Package with a Cu-Filled Through Silicon via and a Multilayer Redistribution Layer Fabricated via Electroplating by Kim, Taeyoo (author);Son, Hwajin (author);Lim, Seung Kyu (author);Song, Yongil (author);Suh, Sujeong (author) is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- Kim, Taeyoo (author);Son, Hwajin (author);Lim, Seung Kyu (author);Song, Yongil (author);Suh, Sujeong (author)
- Publisher
- American Scientific Publishers
- Published
- 2014
- Language
- EN
- Field
- Materials Science (Physical Sciences)