About this scholarly article

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - 3D simulation of filler concentration in semiconductor processing by Hsu, Chih-Chung; Tseng, Huan-Chang; Wang, Tzu-Cheng; Huang, Chao-Tsai; Chang, Rong-Yeu is a scholarly article available to read on EtoBox.

Author

Hsu, Chih-Chung; Tseng, Huan-Chang; Wang, Tzu-Cheng; Huang, Chao-Tsai; Chang, Rong-Yeu

Publisher

IEEE

Published

2015

Language

EN