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About this Engineering article
Hybrid Stacking Structure of Electroplated Copper Onto Graphene for Future Interconnect Applications by Su, Ya-Wen; Wu, Cen-Shawn; Liu, Chih-Hua; Lin, Hung-Yi; Chen, Chii-Dong is a Engineering article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Engineering.
- Author
- Su, Ya-Wen; Wu, Cen-Shawn; Liu, Chih-Hua; Lin, Hung-Yi; Chen, Chii-Dong
- Publisher
- American Institute of Physics; AIP Publishing (ISSN 0003-6951)
- Published
- 2015
- Language
- EN
- Field
- Engineering (Physical Sciences)
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