About this scholarly article

SPIE Proceedings [SPIE SPIE LASE - San Francisco, California, USA (Saturday 23 January 2010)] Laser-based Micro- and Nanopackaging and Assembly IV - Integration of electronics and photonics in active material by femtosecond laser for functional microdevice fabrication by Cheng, Ya; Pfleging, Wilhelm; Lu, Yongfeng; Xu, Zhizhan; Sugioka, Koji; Washio, Kunihiko; Amako, Jun; Midorikawa, Katsumi; Hoving, Willem is a scholarly article available to read on EtoBox.

Author

Cheng, Ya; Pfleging, Wilhelm; Lu, Yongfeng; Xu, Zhizhan; Sugioka, Koji; Washio, Kunihiko; Amako, Jun; Midorikawa, Katsumi; Hoving, Willem

Publisher

SPIE

Published

2010