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About this Materials Science article
Diode Laser Soldering Using a Lead-free Filler Material for Electronic Packaging Structures by C. Chaminade; E. Fogarassy; D. Boisselier is a Materials Science article available to read on EtoBox.
It is typically read by researchers, students, and practitioners in Materials Science.
- Author
- C. Chaminade; E. Fogarassy; D. Boisselier
- Publisher
- Elsevier Science; Elsevier ; Elsevier BV (ISSN 0169-4332)
- Published
- 2006
- Field
- Materials Science (Physical Sciences)
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