About this scholarly article

2008 Electrical Design of Advanced Packaging and Systems Symposium - Optimization of via structure in multilayer PCB for high speed signal transmission by Kang, Bong-Gyu; Hyun Kim, ; Hee-do Kang, ; Yook, Jong-Gwan is a scholarly article available to read on EtoBox.

Author

Kang, Bong-Gyu; Hyun Kim, ; Hee-do Kang, ; Yook, Jong-Gwan

Publisher

IEEE

Published

2008

Language

EN