About this scholarly article

Advances in Electronic Packaging, Parts A, B, and C - Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications by Yin, Chunyan; Lu, Hua; Bailey, Chris; Chan, Yan-Cheong is a scholarly article available to read on EtoBox.

Author

Yin, Chunyan; Lu, Hua; Bailey, Chris; Chan, Yan-Cheong

Publisher

ASMEDC

Published

2005

Language

EN