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About this Engineering article
Evaluation on Influencing Factors of Board-Level Drop Reliability for Chip Scale Packages (Fine-Pitch Ball Grid Array) by Chong, D.Y.R.; Che, F.X.; Pang, J.H.L.; Luhua Xu, ; Xiong, B.S.; Toh, H.J.; Lim, B.K. is a Engineering article available to read on EtoBox.
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- Author
- Chong, D.Y.R.; Che, F.X.; Pang, J.H.L.; Luhua Xu, ; Xiong, B.S.; Toh, H.J.; Lim, B.K.
- Publisher
- IEEE; Institute of Electrical and Electronics Engineers; Institute of Electrical and Electronics Engineers (IEEE) (ISSN 1521-3323)
- Published
- 2008
- Field
- Engineering (Physical Sciences)